Effect of nano Co reinforcements on the structure of the Sn-3.0Ag-0.5Cu solder in liquid and after reflow solid states

Author:

Yakymovych AndriyORCID,Mudry Stepan,Shtablavyi Ihor,Ipser Herbert

Funder

Austrian Science Fund

Publisher

Elsevier BV

Subject

Condensed Matter Physics,General Materials Science

Reference32 articles.

1. COST Action 531-Atlas of Phase Diagrams for Lead-Free Soldering;Dinsdale,2008

2. ELFNET COST Action 531-Handbook of Properties of SAC Solders and Joints;Schmetterer,2008

3. Physical Properties of Lead Free Solders in Liquid and Solid State;Mhiaoui,2007

4. Electrical conductivity, thermoelectric power and viscosity of liquid Sn-based alloys;Plevachuk;J. Mater. Sci.,2006

5. Structure and electric resistance of Sn-Cu(Ag) solders in the precrystallization temperature range;Mudryi;Mater. Sci.,2011

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