Author:
huang xi,zhang liang,Deng Kai,Sun Lei
Reference42 articles.
1. Effect of Ag-decorated MWCNT on the mechanical and thermal property of Sn58Bi solder joints for FCLED package;C.-J Lee;Journal of Materials Science: Materials in Electronics,2020
2. Electromigration effect on Sn-58% Bi solder joints with various substrate metallizations under current stress;S.-M Lee;Journal of Materials Science: Materials in Electronics,2016
3. Mechanical properties and microstructure evolution of Cu/Sn58Bi/Cu solder joint reinforced by B 4 C nanoparticles;C Chen;Journal of Materials Research Technology,2023
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