A chip removal facility for indium bump bonded pixel detectors-Reference-Cited by-同舟云学术

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A chip removal facility for indium bump bonded pixel detectors

Published:2005-03 Issue:2-3 Volume:540 Page:259-265
ISSN:0168-9002
Container-title:Nuclear Instruments and Methods in Physics Research Section A: Accelerators, Spectrometers, Detectors and Associated Equipment
language:en
Short-container-title:Nuclear Instruments and Methods in Physics Research Section A: Accelerators, Spectrometers, Detectors and Associated Equipment

Author:

Airoldi A.,Alimonti G.,Amati M.,Andreazza A.,Bulgheroni A.,Caccia M.,Giugni D.,Kucewicz W.,Lari T.,Meroni C.,Ragusa F.,Troncon C.,Vegni G.

Publisher

Elsevier BV

Subject

Instrumentation,Nuclear and High Energy Physics

Reference10 articles.

1. The challenge of hybridization

2. Atlas Pixel Detector TDR, LHCC 98/13, CERN 1998.

3. ATLAS bump bonding process;Fiorello,2000

4. Study of indium bumps for the ATLAS pixel detector

5. Commissioning of the DELPHI Pixel Detector

Cited by 4 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. On-line testing of flip-chip assemblies;Optoelectronics, Instrumentation and Data Processing;2009-12

2. Tracking at LHC;New Journal of Physics;2007-09-19

3. The ATLAS pixel detector;Nuclear Instruments and Methods in Physics Research Section A: Accelerators, Spectrometers, Detectors and Associated Equipment;2007-09

4. Analysis of the production of ATLAS indium bonded pixel modules;Nuclear Instruments and Methods in Physics Research Section A: Accelerators, Spectrometers, Detectors and Associated Equipment;2006-09

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