Author:
Becks K.H,Brunet J.M,Caccia M,Clemens J.C,Cohen-Solal M,Courty B,de Boer W,Delpierre P,Demaria N,Drees J,Elsing M,Gerlach P,Glitza K.W,Gregor I.M,Guglielmi G,Hartmann F,Heising S,Heuser J.M,Jaeger J.J,Kaiser M,Kersten S,Knoblauch D,Leb H,Ledroit F,Maehlum G,Meroni C,Mönig K,Mouthuy T,Raymond M,Roos L,Sauvage D,Troncon C,Tristram G,Turlot J.P,Überschär B,Vegni G,Wielers M
Subject
Instrumentation,Nuclear and High Energy Physics
Reference10 articles.
1. The DELPHI Collaboration, Proposal for the upgrade of DELPHI in the Forward Region, CERN/LEPC/92-13/P2 Add2, 16 October 1992; A. Andreazza et al., Nucl. Instr. Meth. A 367 (1995) 198.
2. Controlled Collapse Reflow Chip Joining
3. P. Gerlach, Messungen an VFT Pixeldetektoren, Diploma Thesis, University Wuppertal, WU D 96-27, July 1996.
4. J.J. Jaeger et al., IEEE Trans. Nucl. Sci. NS- 41(3) (1994), 632; C. Aubret et al., DELPHI Pixel Detector Readout College de France, Paris, September 13, 1996, available via WWW: http://cdfinfo.in2p3.fr/Experiences/Delphi/VFT/vft.html.
5. RD19 collaboration, A 1006 element hybrid silicon pixel detector with strobed binary output, IEEE Trans. Nucl. Sci. NS-39(4) (1992).
Cited by
8 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Hybrid pixel readout integrated circuits;Nuclear Instruments and Methods in Physics Research Section A: Accelerators, Spectrometers, Detectors and Associated Equipment;2023-12
2. Complementary metal-oxide-semiconductor (CMOS) sensors for high-performance scientific imaging;High Performance Silicon Imaging;2020
3. Silicon strip and pixel detectors for particle physics experiments;Physics Reports;2019-10
4. Complementary metal-oxide-semiconductor (CMOS) sensors for high-performance scientific imaging;High Performance Silicon Imaging;2014
5. A chip removal facility for indium bump bonded pixel detectors;Nuclear Instruments and Methods in Physics Research Section A: Accelerators, Spectrometers, Detectors and Associated Equipment;2005-03