1. V. S. Varavin, S. A. Dvoretsky, V. I. Liberman, et al., “Molecular Beam Epitaxy of High Quality Hg1−x CdxTe Films with Control of the Composition Distribution,” J. Cryst. Growth 159(1–4), 1161–1166 (1996).
2. K.-M. Chu, J.-S. Lee, H. S. Cho, et al., “Characteristics of Indium Bump for Flip-Chip Bonding Used in Polymeric-Waveguide-Integrated Optical Interconnection Systems,” Jap. J. Appl. Phys. 43(8B), 5922–5927 (2004).
3. G. L. Kuryshev, A. P. Kovchavtzev, B. G. Vainer, et al., “Medical Infrared Imaging System Based on a 128×128 Focal Plane Array for 2.8–3.05 µm Spectral Range,” Avtometriya, No. 4, 5–12 (1998) [Optoelectr., Instrum. Data Process., No. 4, 5–10 (1998)].
4. A. Airoldi, G. Alimonti, M. Amati, et al., “A Chip Removal Facility for Indium Bump Bonded Pixel Detectors,” Nucl. Instrum. Meth. Phys. Res. A 540(2/3), 259–265 (2005).
5. A. Paulish, A. Biktashov, N. B. Kuzmin., et al., “Fabrication and Processing of Indium Bumps for Flip-Chip Assembly of Array Photodetectors,” Sensor Electron. Microsyst. Tech., No. 3, 60–65 (2007).