Author:
Long Jianping,Li Xin,Fang Dedi,Peng Peng,He Qiang
Reference22 articles.
1. Status and prospects of metal matrix composites for electronic and packaging;Huang;Electron Packag,2003
2. Status and development of materials for metal packaging;Tong;Electron Packag,2005
3. Research progress of diamond/Cu composite material for electronic packaging;Deng;Diamond Abrasives Eng,2010
4. Effect of Mg and Si in the aluminum on the thermo-mechanical properties of pressureless infiltrated SiC/Al composites;Ren;Compos Sci Technol,2007
5. Micro-structural and tensile strength analyses on the magnesium matrix composites reinforced with coated carbon fiber;Pei;J Mater Sci,2009
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