Latest research progress of SiCp/Al composite for electronic packaging-Reference-Cited by-同舟云学术

Latest research progress of SiCp/Al composite for electronic packaging

Published:2023-01-01 Issue:1 Volume:62 Page:
ISSN:1605-8127
Container-title:REVIEWS ON ADVANCED MATERIALS SCIENCE
language:en
Short-container-title:

Author:

Yu Hong¹,Jiaqin Liu²³,Yucheng Wu¹²³

Affiliation:

1. School of Materials Science and Engineering, Hefei University of Technology , Hefei , Anhui, 230009 , China

2. Laboratory of Nonferrous Metal Material and Processing Engineering of Anhui Province , Institute of Industry & Equipment Technology, Hefei University of Technology , Hefei , Anhui, 230009 , China

3. National-Local Joint Engineering Research Centre of Nonferrous Metals and Processing Technology, Hefei University of Technology , Hefei , Anhui, 230009 , China

Abstract

Abstract With the rapid development, microelectronic technology has put forward strict requirements for electronic packaging materials (EPMs). SiCp/Al composites with high volume fraction of SiC has become an ideal candidate for EPMs due to their superior properties including high thermal conductivity, tailorable coefficient of thermal expansion as well as low density in many fields. This study reviewed the manufacturing process of SiCp/Al composites in recent years. In addition, the interface between particle and matrix, the application, and the development trend of SiCp/Al composites has also been summarized.

Publisher

Walter de Gruyter GmbH

Link

https://www.degruyter.com/document/doi/10.1515/rams-2023-0158/pdf

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