Microstructure, mechanical properties and hermeticity of W-Cu/HTCC brazed joints with surface metallization
Author:
Publisher
Elsevier BV
Subject
Environmental Engineering
Reference42 articles.
1. Integrated circuit packaging review with an emphasis on 3D packaging;Lancaster;Integration,2018
2. Advanced packaging yields higher performance and reliability in power electronics;Bayerer;Microelectron. Reliab.,2010
3. Wafer-level chip-scale package lead-free solder fatigue: a critical review;Arriola;Eng. Fail. Anal.,2023
4. Copper matrix thermal conductive composites with low thermal expansion for electronic packaging;Gao;Ceram. Int.,2020
5. Construction of novel plate-shaped 4H-SiC network skeleton for enhancing 3D-interpenetrated network structure SiC/Al composites;Xie;Ceram. Int.,2022
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