Improving copper plating adhesion on glass using laser machining techniques and areal surface texture parameters-Reference-Cited by-同舟云学术

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Improving copper plating adhesion on glass using laser machining techniques and areal surface texture parameters

Published:2015-12 Issue: Volume:75 Page:39-47
ISSN:0143-8166
Container-title:Optics and Lasers in Engineering
language:en
Short-container-title:Optics and Lasers in Engineering

Author:

He Baofeng,Petzing Jon,Webb Patrick,Leach Richard

Funder

UK Engineering and Physical Sciences Research Council

Wolfson School of Mechanical & Manufacturing Engineering

UK National Measurement Office Engineering & Flow Metrology Programme

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Mechanical Engineering,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference32 articles.

1. Microvias: low cost, high density interconnects;Lau,2000

2. Electroless plating of copper on surface-modified glass substrate;Su;Appl Surf Sci,2011

3. Evolution of microstructure and electrical conductivity of electroless copper deposits on a glass substrate;Cui;Thin Solid Films,2012

4. Challenges in the manufacture of glass substrates for electrical and optical interconnect;Hutt;Circuit World,2007

5. Surface energy, surface topography and adhesion;Packham;Int J Adhes Adhes,2003

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