Funder
Ministry of Science and Technology of the People's Republic of China
National Key Research and Development Program of China
National Natural Science Foundation of China
Subject
Metals and Alloys,Surfaces, Coatings and Films,Biomaterials,Ceramics and Composites
Reference59 articles.
1. High-performance Te-doped p-type MoS2 transistor with high-K insulators;Oh;J Alloys Compd,2021
2. Cu-Cu wire bonding challenges on MOSFET wafer technology;Chee,2013
3. Adhesive enabling technology for directly plating copper onto glass;Mukai,2014
4. Improving copper plating adhesion on glass using laser machining techniques and areal surface texture parameters;He;Opt Laser Eng,2015
5. Direct energy deposition of Mo powder prepared by electrode induction melting gas atomization;Roh;Arch Metall Mater,2021