Laser beam induced thermal-crack propagation for asymmetric linear cutting of silicon wafer-Reference-Cited by-同舟云学术

Laser beam induced thermal-crack propagation for asymmetric linear cutting of silicon wafer

Published:2019-12 Issue: Volume:120 Page:105765
ISSN:0030-3992
Container-title:Optics & Laser Technology
language:en
Short-container-title:Optics & Laser Technology

Author:

Cheng Xiaoliang,Yang Lijun,Wang Maolu,Cai Yecheng,Wang Yang,Ren Zhixing

Funder

National Key R&D Program of China

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference23 articles.

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3. Ultrathin wafer pre-assembly and assembly process technologies: a review;Marks;CRC Crit. Rev. Solid State Sci.,2015

4. Die singulation technologies for advanced packaging: a critical review;Lei;J. Vac. Sci. Technol. B Nanotechnol. Microelectron. Mater. Process. Measure. Phenom.,2012

5. Advanced dicing technology for semiconductor wafer—stealth dicing;Kumagai;IEEE Trans. Semicond. Manuf.,2007

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