1. Die singulation technologies for advanced packaging: a critical review;Lei;J. Vac. Sci. Technol. B,2012
2. Microelectronics Packaging Handbook: Semiconductor Packaging,1997
3. Thin Wafer Market - Global Industry Size, Share, Trends, Analysis AndForecast – 2023, by Transparency Market Research, 〈http://www.transparencymarketresearch.com/thin-wafer-market.html〉 (Accessed 17 June 2003).
4. 〈http://www.grandviewresearch.com/industry-analysis/thin-wafer-market〉 (Accessed 17 September 2003).
5. 〈http://www.prnewswire.com/news-releases/thin-wafer-market-by-wafer-size-process-application-and-region---global-trend-and-forecast-to-2022-300253123.html〉 (Accessed 17 September 2003).