Large-area femtosecond laser milling of silicon employing trench analysis-Reference-Cited by-同舟云学术

Large-area femtosecond laser milling of silicon employing trench analysis

Published:2021-06 Issue: Volume:138 Page:106866
ISSN:0030-3992
Container-title:Optics & Laser Technology
language:en
Short-container-title:Optics & Laser Technology

Author:

Bhaskar Arun,Philippe Justine,Braud Flavie,Okada Etienne,Avramovic Vanessa,Robillard Jean-François,Durand Cédric,Gloria Daniel,Gaquière Christophe,Dubois Emmanuel

Funder

STMicroelectronics

Agence Nationale de la Recherche

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference54 articles.

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