Low Temperature Diffusion Bonding of Ti-6Al-4V to Oxygen Free Copper with High Bonding Strength Using Pure Ag Interlayer
Author:
Publisher
Elsevier BV
Subject
General Medicine
Reference24 articles.
1. Joining of Zirconia and Ti-6A1-4V Using a Ti-based Amorphous Filler
2. Interface microstructure and strength properties of diffusion bonded joints of titanium–Al interlayer–18Cr–8Ni stainless steel
3. Microstructure and bonding strength of diffusion welding of Mo/Cu joints with Ni interlayer
4. Experimental study of diffusion welding/bonding of titanium to copper
5. Strength and microstructure of diffusion bonded titanium using silver and copper interlayers
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1. Improving strength and toughness of Ti–6Al–4V alloy/pure copper diffusion bonded joint with VCrAl1.86Ni1.86 eutectic medium-entropy alloy interlayer;Materials Science and Engineering: A;2023-11
2. Diffusion Welding for TC4 Titanium Alloy/T2 Copper with Vanadium Foil;Welding Journal;2023-07-01
3. The microstructure and mechanical properties of titanium/copper welded joint by FSW;Materials Science and Technology;2022-06-24
4. Diffusion bonding of copper to titanium using CoCrFeMnNi high-entropy alloy interlayer;Intermetallics;2021-02
5. Influence of Effective Physical Contact Area on Microstructure and Mechanical Properties of Diffusion-Bonded TC4/1060Al Joints;Journal of Materials Engineering and Performance;2019-01-11
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