Experimental study of diffusion welding/bonding of titanium to copper
Author:
Publisher
Elsevier BV
Subject
Applied Mathematics,General Mathematics
Reference34 articles.
1. Diffusion bonding of SU 263;Ravisankar;J Mater Process Tech,2009
2. The diffusion welding of 7075Al–3%SiC particles reinforced composites;Aydin;Phys Met Metallogr,2009
3. Dynamic simulation of solid-state diffusion bonding;Wu;Mat Sci Eng A-Struct,2007
4. Influences of diffusion bonding process parameters on bond characteristics of Mg–Cu dissimilar joints;Mahendran;T Nonferr Metal Soc,2010
5. Molecular dynamics modeling of diffusion bonding;Chen;Scripta Mater,2005
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