Diffusion bonding of copper to titanium using CoCrFeMnNi high-entropy alloy interlayer-Reference-Cited by-同舟云学术

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Diffusion bonding of copper to titanium using CoCrFeMnNi high-entropy alloy interlayer

Published:2021-02 Issue: Volume:129 Page:107027
ISSN:0966-9795
Container-title:Intermetallics
language:en
Short-container-title:Intermetallics

Author:

Ding Wen,Liu Ning,Fan Jiacheng,Cao Jing,Wang Xiaojing

Funder

The National Natural Science Foundation of China

Natural Science Foundation of Jiangsu Province

Jiangsu Province

Priority Academic Program Development of Jiangsu Higher Education Institutions

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials,General Chemistry

Reference36 articles.

1. Effect of filler metal composition on microstructure and mechanical properties of electron beam welded titanium/copper joint;Wang;J. Alloys Compd.,2019

2. Microstructure and performance of dissimilar joint QCr0.8/TC4 welded by uncentered electron beam, Rare Metals;Liu,2007

3. Influence of electron-beam superposition welding on intermetallic layer of Cu/Ti joint, the Chin;Chen;J. Nonferr. Metals,2012

4. Study on strengthening mechanism of Ti/Cu electron beam welding;Guo;Mater. Des.,2017

5. Mechanical properties of copper to titanium joined by friction welding;Kim;J. Mater. Sci.,2003

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