Author:
Xu Xinrui,Zhuang Hanrui,Li Wenlan,Jiang Guojian
Subject
Materials Chemistry,Surfaces, Coatings and Films,Process Chemistry and Technology,Ceramics and Composites,Electronic, Optical and Magnetic Materials
Reference20 articles.
1. Transparent AlN ceramics;Kuramoto;J. Mater. Sci. Lett.,1984
2. AlN substrates with high thermal conductivity;Kurokawa;IEEE Trans. Comp. Hybrids Manuf. Technol.,1985
3. Thick film and direct bond copper forming technologies for aluminum nitride substrate;Iwase;IEEE Trans. Comp. Hybrids Manuf. Technol.,1985
4. W. Werdecker, Metallizing of aluminum nitride substrates, in: Proceedings of the Fifth European Hybrid Microelectronics Conference, 1985, pp. 472–488.
5. New technology for high powder hybrid IC;Endoh;Hitachi Hyoron.,1990
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