Surface metallization of Si3N4 ceramics with high-performance silver thick paste containing Bi-B-Zn glass frit
Author:
Funder
Science and Technology Planning Project of Shenzhen Municipality
Publisher
Springer Science and Business Media LLC
Subject
Mechanical Engineering,Mechanics of Materials,General Materials Science
Link
https://link.springer.com/content/pdf/10.1007/s10853-023-08604-2.pdf
Reference36 articles.
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3. Chasserio N, Guillemet-Fritsch S, Lebey T, Dagdag S (2008) Ceramic substrates for high-temperature electronic integration. J Electron Mater 38:164–174. https://doi.org/10.1007/s11664-008-0571-8
4. Chowdhry U, Sleight A (1987) Ceramic substrates for microelectronic packaging. Annu Rev Mater Sci 17:323–340
5. Miyashiro F, Iwase N, Tsuge A, Ueno F, Nakahashi M, Takahashi T (1990) High thermal conductivity aluminum nitride ceramic substrates and packages. IEEE Trans Compon Hybrids, Manufact Technol 13:313–319. https://doi.org/10.1109/33.56163
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