Critical effect and enhanced thermal conductivity of Cu-diamond composites reinforced with various diamond prepared by composite electroplating-Reference-Cited by-同舟云学术

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Critical effect and enhanced thermal conductivity of Cu-diamond composites reinforced with various diamond prepared by composite electroplating

Published:2019-07 Issue:10 Volume:45 Page:13225-13234
ISSN:0272-8842
Container-title:Ceramics International
language:en
Short-container-title:Ceramics International

Author:

Wu Yongpeng,Luo Jiangbo,Wang Yan,Wang Guilian,Wang Hong,Yang Zhuoqing,Ding Guifu

Funder

National Defense Science and Technology Innovation Special Zone

Shanghai Professional Technical Service Platform

Publisher

Elsevier BV

Subject

Materials Chemistry,Surfaces, Coatings and Films,Process Chemistry and Technology,Ceramics and Composites,Electronic, Optical and Magnetic Materials

Reference40 articles.

1. Numerical investigation of the effect of interfacial thermal resistance upon the thermal conductivity of copper/diamond composites;Zain-ul-abdein;Mater. Des.,2015

2. Design of interfacial Cr3C2 carbide layer via optimization of sintering parameters used to fabricate copper/diamond composites for thermal management applications;Ciupinski;Mater. Des.,2017

3. Preparation of copper–diamond composites with chromium carbide coatings on diamond particles for heat sink applications;Kang;Appl. Therm. Eng.,2013

4. Thermal conductivity of SPS consolidated Cu/diamond composites with Cr-coated diamond particles;Chu;J. Alloy. Comp.,2010

5. Large anisotropic thermal conductivity in synthetic diamond films;Graebner;Nature,1992

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