Numerical investigation of the effect of interfacial thermal resistance upon the thermal conductivity of copper/diamond composites-Reference-Cited by-同舟云学术

Numerical investigation of the effect of interfacial thermal resistance upon the thermal conductivity of copper/diamond composites

Published:2015-12 Issue: Volume:86 Page:248-258
ISSN:0264-1275
Container-title:Materials & Design
language:en
Short-container-title:Materials & Design

Author:

Zain-ul-abdein Muhammad,Raza Kabeer,Khalid Fazal Ahmad,Mabrouki Tarek

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,General Materials Science

Reference48 articles.

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3. Standard test method for thermal conductivity of solids by means of the guarded-comparative-longitudinal heat flow technique;ASTM Standard E1225–99,1999

4. Using the finite element method to compute the influence of complex porosity and inclusion structures on the thermal and electrical conductivity;Bakker;Int. J. Heat Mass Transf.,1997

5. Heat transport across the metal–diamond interface

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