Sur la trempe des lacunes dans un polycristal á grains fins-Reference-Cited by-同舟云学术

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Sur la trempe des lacunes dans un polycristal á grains fins

Published:1960-06 Issue:6 Volume:8 Page:384-387
ISSN:0001-6160
Container-title:Acta Metallurgica
language:fr
Short-container-title:Acta Metallurgica

Author:

Blandin A,Friedel J

Publisher

Elsevier BV

Subject

General Engineering

Reference9 articles.

1. Quenched-in Lattice Vacancies in Copper

2. Interpretation of the Quenching Experiments on Gold

3. Quenched-in Lattice Defects in Gold

4. Conduction of Heat in Solids;Carlslaw,1947

Cited by 18 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Influence of microstructure on the resistivity of Al‐Cu‐Si thin‐film interconnects;Journal of Applied Physics;1994-01-15

2. Study of electromigration‐induced resistance and resistance decay in Al thin‐film conductors;Applied Physics Letters;1988-01-18

3. Resistivity study of the annealing kinetics of thin vanadium films;Thin Solid Films;1981-11

4. Condensation de lacunes de trempe en cavites dans une austenite A 0,2% phosphore;Scripta Metallurgica;1980-01

5. The Zener Relaxation: A Convenient Tool to Study Vacancy Sources and Sinks in a Metal Lattice;Internal Friction and Ultrasonic Attenuation in Solids;1980

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