Microscopic mechanism of the hydrogen effect on the ductility of electroless copper-Reference-Cited by-同舟云学术

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Microscopic mechanism of the hydrogen effect on the ductility of electroless copper

Published:1988-07 Issue:7 Volume:36 Page:1669-1681
ISSN:0001-6160
Container-title:Acta Metallurgica
language:en
Short-container-title:Acta Metallurgica

Author:

Nakahara S.

Publisher

Elsevier BV

Subject

General Engineering

Reference28 articles.

1. Elimination of Fractures in Plated-Through-Hole Printed Circuit Boards by the Use of Ductile Plating

2. Proc. AES 2nd Electroless Plating Symp.;Paunovic,1984

3. Hydrogen Embrittlement of Electroless Copper Deposits

4. A Simple Ductility Tester for Metal Films

5. Microstructure and ductility of electroless copper deposits

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1. Effect of Ni addition and bath temperature on electroless Cu microstructure in microvia preparation for HDI substrate;Applied Surface Science;2024-12

2. Hydrogen embrittlement and strain rate sensitivity of electrodeposited copper: part I – the effect of hydrogen content;npj Materials Degradation;2024-08-05

3. Theoretical Exploration of Dehydrogenation Processes for Ni- and Niau-Plated Al-Based Silicon Carbide;2024

4. Effects of Ni Addition and Bath Temperatures on Electroless Cu Microstructure in Microvia Preparation for Hdi Substrate;2024

5. Penetration of corrosive species into copper exposed to simulated O2-free groundwater by time-of-flight secondary ion mass spectrometry (ToF-SIMS);Corrosion Science;2023-01

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