Wetting Behaviors and Interfacial Reaction between Sn-10Sb-5Cu High Temperature Lead-free Solder and Cu Substrate-Reference-Cited by-同舟云学术

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Wetting Behaviors and Interfacial Reaction between Sn-10Sb-5Cu High Temperature Lead-free Solder and Cu Substrate

Published:2010-02 Issue:2 Volume:26 Page:156-162
ISSN:1005-0302
Container-title:Journal of Materials Science & Technology
language:en
Short-container-title:Journal of Materials Science & Technology

Author:

Zeng Qiulian,Guo Jianjun,Gu Xiaolong,Zhao Xinbing,Liu Xiaogang

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Polymers and Plastics,Mechanical Engineering,Mechanics of Materials,Ceramics and Composites

Reference26 articles.

1. High-temperature lead-free SnSb solders: Wetting reactions on Cu foils and phased-in Cu–Cr thin films

2. Study of the mechanical and thermal properties of Sn–5 wt% Sb solder alloy at two annealing temperatures

3. An investigation of the deformation mechanisms in sn5% sb alloy using tensile, creep and abi tests from ambient to 473k

4. Room temperature tensile properties of Sn-5%Sb solder

5. Effect of SnSb Particle Size on Creep Behaviour under Power Law Regime of Sn-10%Sb Alloy

Cited by 21 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Interfacial reaction behavior and thermodynamics between Sn-xSb alloys and Cu substrate;Transactions of Nonferrous Metals Society of China;2023-06

2. Microstructure evolution, IMC growth, and microhardness of Cu, Ni, Ag-microalloyed Sn–5Sb/Cu solder joints under isothermal aging;Journal of Materials Science: Materials in Electronics;2022-10-05

3. Characterization of AA7075 Surface Composites with Ex Situ Al2O3/SiC Reinforcements Tailored Using Friction Stir Processing;Journal of Materials Engineering and Performance;2022-09-28

4. Wetting characteristics of Sn-5Sb-CuNiAg lead-free solders on the copper substrate;Soldering & Surface Mount Technology;2021-08-23

5. Joining of sintered NdFeB permanent magnet to steel using novel Zn-Sn-Bi-Nd alloy: Microstructure and soldering mechanism;Journal of Manufacturing Processes;2021-07

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