Room temperature tensile properties of Sn-5%Sb solder-Reference-Cited by-同舟云学术

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Room temperature tensile properties of Sn-5%Sb solder

Published:1994 Issue:19 Volume:13 Page:1387-1389
ISSN:0261-8028
Container-title:Journal of Materials Science Letters
language:en
Short-container-title:JOURNAL OF MATERIALS SCIENCE LETTERS

Author:

Mahidhara R. K.,Sastry S. M. L.,Jerina K. L.,Turlik I.,Murty K. L.

Publisher

Springer Science and Business Media LLC

Subject

General Materials Science

Link

http://link.springer.com/content/pdf/10.1007/BF00405039.pdf

Reference14 articles.

1. S. Jin, J. Metals 45 (1993) 13.

2. D. Hanson and E. J. Sanford, J. Inst. Metals 59 (1936) 159.

3. Idem., ibid. 62 (1938) 215.

4. J. Hwang, in ?Electronics packaging and interconnection handbook? (McGraw-Hill, New York, 1991).

5. P. T. Vianco and D. R. Frear, J. Metals 45 (1993) 14.

Cited by 16 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Analysis of extensive wetting angle vs. cooling rate data in Bi-, Zn- and Sn-based solder alloys;Microelectronics Reliability;2022-08

2. The application of an analytical model to solve an inverse heat conduction problem: Transient solidification of a Sn-Sb peritectic solder alloy on distinct substrates;Journal of Manufacturing Processes;2019-12

3. Nondestructive evaluation of mechanical properties of nanostructured Al−Cu alloy at room and elevated temperatures;Transactions of Nonferrous Metals Society of China;2019-12

4. Nondestructive measurements of flow properties of nanocrystalline Al-Cu-Ti alloy using Automated Ball Indentation (ABI) technique;Materials Science and Engineering: A;2018-06

5. Microstructure and tensile behavior of Sn–5Sb lead-free solder alloy containing Bi and Cu;Materials Science and Engineering: A;2011-12

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