Author:
MA Wen-jing,KE Chang-bo,LIANG Shui-bao,ZHOU Min-bo,ZHANG Xin-ping
Subject
Materials Chemistry,Metals and Alloys,Geotechnical Engineering and Engineering Geology,Condensed Matter Physics
Reference27 articles.
1. Phase field simulation on microstructure evolution and growth kinetics of Cu6Sn5 intermetallic compound during early interfacial reaction in Sn/Cu soldering system [J];KE;Acta Metallurgica Sinica,2014
2. Undercooling behavior and intermetallic compound coalescence in microscale Sn–3.0Ag– 0.5Cu solder balls and Sn–3.0Ag–0.5Cu/Cu joints [J];ZHOU;Journal of Electronic Materials,2012
3. Electromigration induced microstructure evolution and damage in asymmetric Cu/Sn–58Bi/Cu solder interconnect under current stressing [J];YUE;Transactions of Nonferrous Metals Society of China,2014
4. Research progress in thermomigration of metal atoms in micro solder joints and its effect on interfacial reaction [J];ZHAO;The Chinese Journal of Nonferrous Metals,2015
5. Effect of temperature on interface diffusion in micro solder joint under current stressing [J];LI;Transactions of Nonferrous Metals Society of China,2015
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