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Property alterations of Sn-0.6Cu-0.05Ni-Ge lead-free solder by Ag, Bi, In and Sb addition

  • Published:2018-06 Issue:6 Volume:28 Page:1166-1175
  • ISSN:1003-6326
  • Container-title:Transactions of Nonferrous Metals Society of China
  • language:en
  • Short-container-title:Transactions of Nonferrous Metals Society of China

Author:

KANLAYASIRI Kannachai,KONGCHAYASUKAWAT Rachata

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Geotechnical Engineering and Engineering Geology,Condensed Matter Physics

Reference49 articles.

1. Lead-free solders in microelectronics [J];ABTEW;Materials Science and Engineering R,2000

2. Lead-free solder interconnect reliability [M];SHANGGUAN,2005

3. Impact of drop-in lead free solders on microelectronics packaging [C];CHEW,2005

4. High drop test reliability: lead-free solders [C];AMAGAI,2004

5. Recent advances on Sn-Cu solders with alloying elements: Review [J];ZENG;Journal of Materials Science: Materials in Electronics,2011

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