Locally reinforced polymer-based composites for efficient heat dissipation of local heat source-Reference-Cited by-同舟云学术

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Locally reinforced polymer-based composites for efficient heat dissipation of local heat source

Published:2016-04 Issue: Volume:102 Page:202-209
ISSN:1290-0729
Container-title:International Journal of Thermal Sciences
language:en
Short-container-title:International Journal of Thermal Sciences

Author:

Yuan Chao,Li Lan,Duan Bin,Xie Bin,Zhu Yongming,Luo Xiaobing

Funder

National Science Foundation of China

Ministry of Science and Technology of China

Publisher

Elsevier BV

Subject

General Engineering,Condensed Matter Physics

Reference30 articles.

1. Study on heat conduction in a simulated multicore processor chip-part I: analytical modeling;Nakayama;ASME J. Electron. Packag,2013

2. Study on heat conduction in a simulated multicore processor chip-part II: case studies;Nakayama;ASME J. Electron. Packag.,2013

3. Thermal characterization of interlayer microfluidic cooling of three-dimensional integrated circuits with nonuniform heat flux;Kim;ASME J. Heat. Transf.,2010

4. Thermal management of on-chip hot spot;Bar-Cohen;ASME J. Heat. Transf.,2012

5. PDMS nanocomposites for heat transfer enhancement in microfluidic platforms;Yi;Lab. Chip,2014

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