Subject
General Engineering,Condensed Matter Physics
Reference27 articles.
1. Heat Conduction;Hahn,2012
2. An explicit analytical model for rapid computation of temperature field in a three-dimensional integrated circuit (3D IC);Choobineh;Int. J. Therm. Sci.,2015
3. A novel chip design for improving deep-submicrometer interconnect performance and systems-on-chip integration;Banerjee;Proc. IEEE,2001
4. ‘3D Die-To-Wafer Cu/Sn Microconnects Formed Simultaneously with an Adhesive Dielectric Bond Using Thermal Compression Bonding,’ 2008 International Interconnect Technology Conference;Pozder,2008
5. Review and projections of integrated cooling systems for three-dimensional integrated circuits;Kandlikar;ASME J. Electron. Packag.,2014
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