Author:
Trumpold H.,Hattori M.,Tsutsumi C.,Melzer C.
Subject
Industrial and Manufacturing Engineering,Mechanical Engineering
Reference18 articles.
1. Measuring the very small cutting edge radius for a diamond tool using a new type of SEM having two detectors;Asai;CIRP Annals,1990
2. Ductile-Regime Grinding: A New Technology for Machining Brittle Materials;Bifano;Journal of Eng. for Industry,1991
3. Specific grinding energy as an in-process control variable for ductile grinding;Bifano;Prec. Eng.,1991
4. Fractal analysis of topographic data by the patchwork method;Brown;Wear,1993
5. Ichida, Y., Kishi, K., Zouaghi, N., Ben Fredhj, N. 1992, Nanometer-Scale Morphology of Ductile Ground Surface of Silicon Carbide Ceramics with AFM, Proc. of The First China - Japan Int. Conf. on Progress of Cutting and Grinding, 187-192.
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