1. T. Dobrescu, N.E. Pascu, M. Ghinea, A. Popescu, PLANE LAPPING PROCESS OF SILICON WAFERS, Recent Advances in Robotics, Aeronautical & Mechanical Engineering, Recent Advances in Mechanical Engineering Series 4, PROCEEDINGS of the 1st International Conference on Mechanical and Robotics Engineering (MREN’13), 14-16 May 2013, Vouliagmeni, Athens, Greece, ISSN 2227-4596 ISBN 978-1-61804-185-2, Published by WSEAS Press, www.wseas.org, pp. 69-72, 2013.
2. T. Dobrescu, N.E. Pascu, A. Nicolescu, G. Enciu, Optimal design of brittle materials superfinishing machine, Annals of DAAAM for 2012&Proceedings of the 23rd International DAAAM Symposium, 24-27 october 2012, Zadar, Croatia, ISSN2304-1382, ISBN 978-3-901509-91-9, Katalinic, B. (Ed.), pp. 0159-0162, Publisher by DAAAM International, Austria 2012.
3. T. G. Bifano, T.A. Dow, R.O. Scattergood, Ductile-Regime Grinding: A New Technology for Machining Brittle Materials,Journal of Engineering for Industry, No. 113, 1991, pp. 184-189.
4. Yiying Zhang, Ioan Marinescu, Rick VandenBoom, OPTIMISATION OF D2 STEEL LAPPING WITH APOLIMER PLATE, International Journal of Abrasive Technology, Volume 3, Number 3/2010, DOI: 10.1504/IJAT. 2010.034051, ISSN 1752-2641 ISSN 1752-265X pp. 203-214, 2010.
5. H. Trumpold,M. Hattori, C. Tsutsumi, C. Melzer, Grinding Mode Identification by Means of Surface Characterization, Annals of CIRP, No. 43, 1994, pp. 479-481.