Defect-free Fabrication for Single Crystal Silicon Substrate by Chemo-Mechanical Grinding
Author:
Publisher
Elsevier BV
Subject
Industrial and Manufacturing Engineering,Mechanical Engineering
Reference16 articles.
1. Chemical Aspects of Machining Process;Brinksmeier;Annals of CIRP,2004
2. Abrasive Machining of Silicon;Tönshoff;Annals of CIRP,1990
3. A New Technology for Machining Brittle Materials;Bifano;ASME J. Eng'g for Industry,1991
4. Molecular Dynamics of Silicon Indentation;Kallman;Physical Review B,1993
5. Towards a Deeper Understanding of Plastic Deformation in Single crystal Silicon;Zhang;Int'l J. of Mechanical Sciences,2001
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