Failure analysis from microcracks to a dominant crack in MEMS thin films using combined damage and fracture mechanics
Author:
Funder
National Key Research and Development Program of China
Publisher
Elsevier BV
Subject
General Engineering,General Materials Science
Reference35 articles.
1. Zero-power ultrasonic wakeup receiver based on MEMS switches for implantable medical devices;Pop;IEEE. T. Electron. Dev.,2022
2. Active temperature compensation for MEMS capacitive sensor;Do;IEEE. Sens. J.,2021
3. A zero-power sensing MEMS shock sensor with a latch-reset mechanism for multi-threshold events monitoring;Reddy;Senso. Actuat. A-Phys,2019
4. Altitude information acquisition of uav based on monocular vision and mems;Gao;J. Intell. Robot. Syst.,2020
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