Diffusionally accommodated interfacial sliding in metal-silicon systems
Author:
Publisher
Elsevier BV
Subject
Metals and Alloys,Polymers and Plastics,Ceramics and Composites,Electronic, Optical and Magnetic Materials
Reference36 articles.
1. Thermal cycling-induced deformation of fibrous composites with particular reference to the tungsten-copper system
2. Role of interfacial sliding on the longitudinal creep response of continuous fiber reinforced metal-matrix composites
3. Role of interfacial and matrix creep during thermal cycling of continuous fiber reinforced metal–matrix composites
4. Interfacial sliding in Cu/Ta/polyimide high density interconnects as a result of thermal cycling
5. Rate effects in metal-ceramic interface sliding from the periodic film cracking technique
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