Microstructure and Mechanical Reliability Issues of TSV
Author:
Publisher
Springer Singapore
Link
http://link.springer.com/content/pdf/10.1007/978-981-15-7090-2_4
Reference90 articles.
1. H.J. Bunge, R.A. Schwarzer, Orientation stereology—a new branch in texture research. Adv. Eng. Mater. 3, 25–39 (2001)
2. H.J. Bunge, Texture Analysis in Materials Science—Mathematical Methods (Butterworth & Co, London, 1982)
3. T. Hrncir, J. Dluhos, L. Hladik, E. Moyal, Advances in FIB-SEM analysis of TSV and solder bumps—approaching higher precision, throughput and comprehensiveness, in IST-FA 2014: Proceedings of the 40th International Symposium for Testing and Failure Analysis (Houston, Texas, USA, November 2014)
4. B. Wu, A. Kumar, S. Pamarthy, High aspect ratio silicon etch: a review. J. App. Phys. 108, 051101 (2010)
5. L.B. Mauer, J. Taddei, R. Yousself, Wet silicon etch process for TSV reveal, in Electronic Components and Technology Conference, IEEE, p. 878 (2014)
Cited by 3 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Void Nucleation in a Through Silicon Via (TSV): Unraveling the Role of Tilt Grain Boundaries Through Atomistic Investigation;The Minerals, Metals & Materials Series;2024
2. Grain Orientation and Prediction of Thermal Shock Fatigue of Sn-3Ag-0.5Cu Solder Joints for Fan-Out Wafer Level Packaging;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05
3. A Quantitative Evaluation of the Inelastic Energy Absorptions in Cu-Polyimide Interconnect and the Effect on Interface Debond Driving Force;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3