1. Thermal resistance analysis by induced transient (TRAIT) method for power electronic devices thermal characterization. Part I: fundamentals and theory;Bagnoli;IEEE Transactions in Power Electronics,1998
2. A. Maierna, M. Brezza, P.E. Bagnoli, C. Casarosa, E. Dallago, F. Perotti, Experimental characterization of automotive electronic packaging by TRAIT method: preliminary results, in: Proceedings of the ISHM Conference 94, Milan, Italy, June 1994, pp. 209–216.
3. J.W. Sofia, Analysys of thermal transient data with systesized dynamic models for semiconductor devices, in: Proceedings of the SEMITHERM’94, San Jose, CA, 1995, pp. 78–85.
4. E. Farjah, Ch. Shaeffer, R. Perret, Experimental thermal parameter extraction using non-destructive tests, in: Proceedings of EPE’95 Conference, Sevilla, Spain, vol. 1, 1995, pp. 1245–1248.
5. V. Szekely, A new evaluation method of thermal transient measurement results, Proceedings of the International Workshop on Thermal Investigations of ICs and Microstructures, Grenoble, France, September 1995, pp. 108–114.