Transient thermal analysis as measurement method for IC package structural integrity

Author:

Hanß Alexander,Schmid Maximilian,Liu E,Elger Gordon

Publisher

IOP Publishing

Subject

General Physics and Astronomy

Cited by 34 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Fast Characterization of Power LEDs: Circuit Design and Experimental Results;IEEE Transactions on Electron Devices;2024-06

2. Infrared Thermal Imaging-Based Power MOSFET Thermal Resistance Test Method Research;2023 Global Reliability and Prognostics and Health Management Conference (PHM-Hangzhou);2023-10-12

3. Transient thermal analysis for VCSEL Diodes;2023 29th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC);2023-09-27

4. Investigations on High-Power LEDs and Solder Interconnects in Automotive Application: Part II—Reliability;IEEE Transactions on Device and Materials Reliability;2023-09

5. Crack Growth Prediction in High-Power LEDs from TTA, SAM and Simulated Data;2022 28th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC);2022-09-28

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