On the modelling of multiconductor multilayer systems for interconnect applications-Reference-Cited by-同舟云学术

On the modelling of multiconductor multilayer systems for interconnect applications

Published:2001-04 Issue:4 Volume:32 Page:351-355
ISSN:0026-2692
Container-title:Microelectronics Journal
language:en
Short-container-title:Microelectronics Journal

Author:

Ymeri H.,Nauwelaers B.,Maex K.

Publisher

Elsevier BV

Subject

General Engineering

Reference19 articles.

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Cited by 6 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. A CAD-oriented analytical model for frequency-dependent series resistance and inductance of microstrip on-chip interconnect on silicon substrate;Microprocessors and Microsystems;2002-02

2. Frequency-dependent mutual resistance and inductance formulas for coupled IC interconnects on an Si-SiO2 substrate;Integration;2001-10

3. New closed-form formula for frequency-dependent resistance and inductance of IC interconnects on silicon substrate;Journal of Micromechanics and Microengineering;2001-04-20

4. Accurate frequency-dependent formula for series line impedance of microstrip on lossy silicon substrate;2001 International Symposium on Electron Devices for Microwave and Optoelectronic Applications. EDMO 2001 (Cat. No.01TH8567)

5. New analytic expressions for mutual inductance and resistance of coupled interconnects on lossy silicon substrate;2001 Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems. Digest of Papers (IEEE Cat. No.01EX496)