A CAD-oriented analytical model for frequency-dependent series resistance and inductance of microstrip on-chip interconnect on silicon substrate-Reference-Cited by-同舟云学术

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A CAD-oriented analytical model for frequency-dependent series resistance and inductance of microstrip on-chip interconnect on silicon substrate

Published:2002-02 Issue:1 Volume:26 Page:45-48
ISSN:0141-9331
Container-title:Microprocessors and Microsystems
language:en
Short-container-title:Microprocessors and Microsystems

Author:

Ymeri Hasan,Nauwelaers Bart,Maex Karen,Vandenberghe Servaas,De Roest David

Publisher

Elsevier BV

Subject

Artificial Intelligence,Computer Networks and Communications,Hardware and Architecture,Software

Reference10 articles.

1. VLSI on-chip interconnection performance simulations and measurements;Edelstein;IBM J. Res. Develop.,1995

2. Quasi-analytical analysis of the broad-band properties of multiconductor transmission lines on semiconducting substrates;Groteluschen;IEEE Trans. Compos. Package Manufact. Technol. B,1994

3. Metal–insulator–semiconductor transmission lines;Williams;IEEE Trans. MTT,1999

4. Characterization of broad-band transmission for coplanar waveguides on CMOS silicon substrates;Milanovic;IEEE Trans. MTT,1998

5. Modeling the substrate effect in interconnect line characteristics of high-speed VLSI circuits;Wee;IEEE Trans. MTT,1998

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