Collective fabrication of microsystems compatible with CMOS through the CMP service-Reference-Cited by-同舟云学术

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Collective fabrication of microsystems compatible with CMOS through the CMP service

Published:1995-12 Issue:1-3 Volume:35 Page:219-223
ISSN:0921-5107
Container-title:Materials Science and Engineering: B
language:en
Short-container-title:Materials Science and Engineering: B

Author:

Karam J.M.,Courtois B.,Paret J.M.

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference5 articles.

1. Prototypage multi-projet de microsystèmes;Courtois;Microtechnol. Microsyst.,1995

2. Test structures for determining design rules for microelectromechanical-based sensors and actuators;Zincke,1994

3. Gallium arsenide as a mechanical material;Hjort;J. Micromech. Microeng.,1994

4. metallic microdevices fabricated by deep-etch UV lithography;Daniau;Mater. Sci. Eng.,1993

5. MPC services available worldwide;Courtois,1994

Cited by 4 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Achievements and Advances at CMP;Microelectronics Education;2000

2. Providing technology infrastructure for MEMS;SPIE Proceedings;1999-03-10

3. CAD tools and foundries to boost microsystems development;Materials Science and Engineering: B;1998-02

4. Access to microsystem technology: the MPC services solution;Microelectronics Journal;1997-05

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