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Metallic microdevices fabricated by deep-etch UV lithography

  • Published:1993-02 Issue:2 Volume:160 Page:5-8
  • ISSN:0921-5093
  • Container-title:Materials Science and Engineering: A
  • language:en
  • Short-container-title:Materials Science and Engineering: A

Author:

Daniau W.,Ballandras S.,Berçot P.,Hauden D.

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference7 articles.

1. Silicon as a mechanical material;Petersen,1982

2. Mikromechanik, korrigierter Nachdruck;Heuberger,1991

3. Three-dimensional microfabrication using synchrotron radiation;Ehrfeld;Nucl. Instrum. Methods A,1991

4. Lithography for manufacturing at 0.25 micrometer and below;Smith,1992

5. The LIGA process for Microsystems;Ehrfeld,1990

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1. Design and Use of Wafer Level Fluidic Packaging for Surface Acoustic Wave Sensors;2007 IEEE International Frequency Control Symposium Joint with the 21st European Frequency and Time Forum;2007-05

2. Microgrippers fabricated by the LIGA technique;Sensors and Actuators A: Physical;1997-03

3. Low-cost technology for multilayer electroplated parts using laminated dry film resist;Sensors and Actuators A: Physical;1996-05

4. Collective fabrication of microsystems compatible with CMOS through the CMP service;Materials Science and Engineering: B;1995-12

5. Fabrication of an electrostatic wobble micromotor using deep-etch UV lithography, nickel electroforming and a titanium sacrificial layer;Journal of Micromechanics and Microengineering;1995-12-01
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