1. Proceedings of the 1994 International Conference and Exhibition on MCMs;Peterson,1994
2. Use of CVD diamond in high power packages;Moravec,1993
3. The use of diamond substrates for implementing 3-D MCMs;Moravec,1993
4. Comparison of CVD diamond to other substrate materials for thermal management;Chandran,1996
5. Comparison FEA study of the thermal performance of diamond substrates in face-up and flip-chip bonded electronic packaging applications;Brown,1997