Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference27 articles.
1. Implementation of three-dimensional SOI-MEMS wafer-level packaging using through-wafer interconnections;Lin;J. Micromech. Microeng.,2007
2. 3-D silicon integration and silicon packaging technology using silicon through-vias;Knickerbocker;IEEE J. Solid-St. Circ.,2006
3. Reliability of micro-interconnects in 3D IC packages;Kao;Microelectron. Reliab.,2013
4. High aspect ratio through-wafer interconnect for three dimensional integrated circuits;Ranganathan,2005
5. Thermo-mechanical characterization of copper through-wafer interconnects;Miranda,2006
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