The effect of cooling rate on the dendritic spacing and morphology of Ag3Sn intermetallic particles of a SnAg solder alloy
Author:
Publisher
Elsevier BV
Subject
Applied Mathematics,General Mathematics
Reference26 articles.
1. Modelling of Ag3Sn coarsening and its effect on creep of Sn–Ag eutectics;Gong;Mater Sci Eng,2006
2. Properties of lead-free solder alloys with rare earth element additions;Wu;Mater Sci Eng,2004
3. Crystallization, morphology and distribution of Ag3Sn in Sn–Ag–Cu alloys and their influence on the vibration fracture properties;Song;Mater Sci Eng,2007
4. Ag3Sn plate formation in the solidification of near ternary eutectic Sn–Ag–Cu alloys;Henderson;J Mater Res,2002
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3. Impact of Cooling Rate and Nickel Addition on the Dendritic Spacing, Ag3Sn Morphology and Cytotoxicity of Sn-2Ag Solder;Journal of Electronic Materials;2023-09-12
4. Ag3Sn Morphology Transitions During Eutectic Growth in Sn–Ag Alloys;Metallurgical and Materials Transactions A;2023-01-27
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