Bonding through novel solder-metallic mesh composite design
Author:
Publisher
Elsevier BV
Subject
Mechanical Engineering,Mechanics of Materials,General Materials Science
Reference26 articles.
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3. Electromigration effect on Sn-58% Bi solder joints with various substrate metallizations under current stress;Lee;J. Mater. Sci. Mater. Electron.,2016
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2. Accelerated solid-liquid interdiffusion bonding of Cu joint using a Cu10Ni alloy mesh reinforced SAC305 composite solder;Journal of Materials Research and Technology;2024-03
3. Accelerated Solid-Liquid Interdiffusion Bonding of Cu Joint Using a Cu10ni Alloy Mesh Reinforced Sac305 Composite Solder;2024
4. Ultrasonic-assisted soldering of Al alloy using a novel Ni mesh reinforced Sn-9Zn solder;2023 24th International Conference on Electronic Packaging Technology (ICEPT);2023-08-08
5. Accelerated Solid-Liquid Interdiffusion Bonding of Cu Joint Using a Cu10ni Alloy Mesh Reinforced Sac305 Composite Solder;2023
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