Interfacial microstructures and mechanical properties of Sn–9Zn–0.5Ga–xNd on Cu substrate with aging treatment
Author:
Publisher
Elsevier BV
Subject
Applied Mathematics,General Mathematics
Reference25 articles.
1. High temperature oxidation of a Sn–Zn–Al solder;Lin;Oxid. Met.,1998
2. Study on the properties of Sn–9Zn–xCr lead-free solder;Chen;J. Alloy. Compd.,2008
3. Effect of composition and thermal cycling on the adhesion strength of Sn–Zn–Al solder hot-dipped on Cu substrate;Yu;J. Mater. Sci.,2002
4. Solderability of Sn–9Zn–0.5Ag–1In lead-free solder on Cu substrate;Chang;J. Alloy. Compd.,2006
5. Effect of a trace of Bi and Ni on the microstructure and wetting properties of Sn–Zn–Cu lead-free solder;Ma;J. Mater. Sci. Technol.,2007
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