Solderability of Sn–9Zn–0.5Ag–1In lead-free solder on Cu substrate
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials
Reference24 articles.
1. Tensile Properties of Sn-3.5Ag and Sn-3.5Ag-0.75Cu Lead-free Solders
2. Determination of reactive wetting properties of Sn, Sn–Cu, Sn–Ag, and Sn–Pb alloys using a wetting balance technique
3. Interface Reaction and Mechanical Properties of Lead-free Sn-Zn Alloy/Cu Joints
4. Tin-silver-copper eutectic temperature and composition
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