Publisher
Springer Science and Business Media LLC
Subject
Electrical and Electronic Engineering,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference43 articles.
1. H. Ma, J. Suhling, A review of mechanical properties of lead-free solders for electronic packaging. J. Mater. Sci. 44, 1141–1158 (2009)
2. L.C. Tsao, Corrosion Resistance of Pb-Free and Novel Nano-Composite Solders in Electronic Packaging. (2006)
3. K.N. Tu, K. Zeng, Tin-lead (SnPb) solder reaction in flip chip technology. Mater. Sci. Eng. R Rep. 34(1), 1–58 (2001)
4. N. Barry, University of Birmingham Research Archive. (2008)
5. E.P. Wood, K.L. Nimmo, C.T. Centre, S. Lane, U. Kingdom, J. Electron. Mater. 23(8), 709 (1994)
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