Thermally stable high temperature die attach solution
Author:
Publisher
Elsevier BV
Subject
Mechanical Engineering,Mechanics of Materials,General Materials Science
Reference15 articles.
1. Die Attach Materials for High Temperature Applications: A Review;Manikam,2011
2. Mechanical properties of sintered Ag–Cu die-attach nanopaste for application on SiC device;Tan;Mater. Des.,2014
3. Are sintered silver joints ready for use as interconnect material in microelectronic packaging?;Siow;J. Electron. Mater.,2014
4. Metal–metal bonding process using Ag metallo-organic nanoparticles;Ide;Acta Mater.,2005
5. Design of lead-free candidate alloys for high-temperature soldering based on the Au–Sn system;Chidambaram;Mater. Des.,2010
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