Funder
Ministry of Education, Culture, Sports, Science and Technology
Subject
Mechanics of Materials,General Chemical Engineering
Reference46 articles.
1. Review of wide band-gap semiconductors technology;Jin,2016
2. Evaluating suitable semiconducting materials for cryogenic power electronics;Bradley;J. Eng.-Joe,2019
3. Flux-free direct chip attachment of solder-bump flip chip by Ar+H-2 plasma treatment;Hong;J. Electron. Mater.,2002
4. High-temperature die attachment using Sn-plated Zn solder for power electronics;Park;IEEE Trans. Compon. Packag. Manuf. Technol.,2015
5. Enhanced pressure-free bonding using mixture of Cu and NiO nanoparticles;Satoh;J. Alloy. Compd.,2015
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