Effects of intermetallic compound layer thickness on the mechanical properties of silicon-copper interface
Author:
Funder
National Natural Science Foundation of China
Publisher
Elsevier BV
Subject
Mechanical Engineering,Mechanics of Materials,General Materials Science
Reference47 articles.
1. Ultrathin Cu films on Si(111): Schottky barrier formation and sensor applications;Nienhaus;J. Vac. Sci. Technol. A.,1999
2. Through-silicon via stress characteristics and reliability impact on 3D integrated circuits;Jiang;MRS Bull.,2015
3. In situ mechanical characterization of the mixed-mode fracture strength of the Cu/Si interface for TSV structures;Wu;Micromachines.,2019
4. Morphology and surface properties of Cu thin film on Si (001);Mes-adi;Thin Solid Films,2020
5. Surface morphology and composition of films grown by size-selected Cu nanoclusters;Majumdar;Vacuum,2008
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